Liao Yongbo_ECC 2023

Biography
Prof. Yongbo Liao University of Electronic Science and Technology, China
Biography: Liao Yongbo, Associate professor, received bachelor's degree in Microelectronics Science and Technology from University of Electronic Science and Technology of China in 1999, Master's degree in microelectronics and solid-state electronics from Lanzhou University in July 2006, and Doctor's degree in microelectronics and solid-state electronics from University of Electronic Science and Technology of China in July 2010. From 2014 to 2015, he was a state-sponsored visiting scholar at University of Kansas. October - November 2017, Visiting scholar of Belgium IMEC appointed by the state. From August to September 2018, he was a visiting scholar of Australian Robot Vision Center, University of Technology Sydney and Queensland University of Technology. Since July 1999, he has been teaching at UESTC for more than ten years. Engaged in scientific research work and completed more than 50 projects, including 863, 973 and nuclear high-tech projects, and other provincial and ministerial projects. Mainly concerned with the analysis, modeling and design methodology of high performance digital and mixed-signal integrated circuits, Such as brain algorithm, artificial intelligence algorithm, FPGA integrated circuit, CPLD integrated circuit, infrared readout circuit, calculator integrated circuit, digital audio power amplifier integrated circuit, detection readout integrated circuit and some other circuits; Power management integrated circuit design, such as DC/DC conversion chip, AC/DC conversion chip, PFC power factor compensation chip; Software/hardware co-simulation technology, such as the design and implementation of SOC soft/hardware co-verification system, software/hardware co-simulation system based on FPGA and Modelsim (EDA software); Research on micro energy harvesting system, including vibration energy harvesting, microwave energy harvesting and MPPT; Anti-nuclear reinforcement technology, such as total dose reinforcement circuit and anti-single particle flip and lock circuit design; Sensor readout circuit design, such as temperature sensor chip, infrared readout circuit chip and Geiger readout circuit chip. He has published more than 60 papers, obtained more than 30 Chinese invention patents, and published 5 books.

Biography

Prof. Yongbo Liao
University of Electronic Science and Technology, China

Biography:
Liao Yongbo, Associate professor, received bachelor's degree in Microelectronics Science and Technology from University of Electronic Science and Technology of China in 1999, Master's degree in microelectronics and solid-state electronics from Lanzhou University in July 2006, and Doctor's degree in microelectronics and solid-state electronics from University of Electronic Science and Technology of China in July 2010. From 2014 to 2015, he was a state-sponsored visiting scholar at University of Kansas. October - November 2017, Visiting scholar of Belgium IMEC appointed by the state. From August to September 2018, he was a visiting scholar of Australian Robot Vision Center, University of Technology Sydney and Queensland University of Technology. Since July 1999, he has been teaching at UESTC for more than ten years. Engaged in scientific research work and completed more than 50 projects, including 863, 973 and nuclear high-tech projects, and other provincial and ministerial projects. Mainly concerned with the analysis, modeling and design methodology of high performance digital and mixed-signal integrated circuits, Such as brain algorithm, artificial intelligence algorithm, FPGA integrated circuit, CPLD integrated circuit, infrared readout circuit, calculator integrated circuit, digital audio power amplifier integrated circuit, detection readout integrated circuit and some other circuits; Power management integrated circuit design, such as DC/DC conversion chip, AC/DC conversion chip, PFC power factor compensation chip; Software/hardware co-simulation technology, such as the design and implementation of SOC soft/hardware co-verification system, software/hardware co-simulation system based on FPGA and Modelsim (EDA software); Research on micro energy harvesting system, including vibration energy harvesting, microwave energy harvesting and MPPT; Anti-nuclear reinforcement technology, such as total dose reinforcement circuit and anti-single particle flip and lock circuit design; Sensor readout circuit design, such as temperature sensor chip, infrared readout circuit chip and Geiger readout circuit chip. He has published more than 60 papers, obtained more than 30 Chinese invention patents, and published 5 books.